The pre-printed sheet of sample images included with each kit lets you experience just how fine a line you can do with our system.
Click on the imags below you'll see enlargements of the finer traces showing 2 traces running between convnetional .1" IC thru-hole IC pins.
Now using any standard 1200 dpi laser printer and the TIA applicator, you can image down to .006" (and finer!) We've had customers who have reported doing traces down to .004"!
You now have "fine-line" capability at your fingertips without the need for any negatives, coated boards, UV exposure lamps or any photography of any kind.... and do it all in about 8 minutes.
Notice the pattern shown here is reversed or "mirrored". This is necessary when you are puttting any image on the TOP of the board. Traces that go on the bottom of the board are NOT mirrored. You just print the image "normal" (right-reading). The transfer paper always 'reverses' one time.
Most all software programs handle this automatically for you. If you have identified traces to be the "TOP" the software will automatically reverse the printing of all "TOP" images. Thru-hole donut pads print on both TOP and BOTTOM printouts.
Noticehow on the completed board below, the image reversed itself from the printed image on the right. Whatever is printed will always reverse itself when transferred.
Generally speaking, most PCB software layout applications know to do this automatically IF you setup what is to be "Top" and "Bottom" traces. Some apps don't do this so you'll have to look at how your particular program handles this.
After etcing we tin-plated half of the board. Tin will prevent ozidation which would otherwise happen to exposed copper to the elements. We found the best solution to use for this 1 minute process is a product called "Liquid Tin" available from MG Chemicals. The photo doesn't do the board justice because both copper and tin are extremely shiney and that make it difficult to capture by camera. CLICK TO ENLARGE